Low-cure Stress Adhesives Market

Low-cure Stress Adhesives Market Outlook (2022-2032)

The global low-cure stress adhesives market is set to enjoy a valuation of US$ 252.3 million in 2022 and expand at a CAGR of 9% to reach US$ 596.7 million by the end of 2032.

Sales of low-cure stress adhesives accounted for close to 1% share of the global adhesives market at the end of 2021.

Report Attributes	Details
Low-cure Stress Adhesives Market Size (2021A)	US$ 232.3 Million
Estimated Market Value (2022E)	US$ 252.3 Million
Forecasted Market Value (2032F)	US$ 596.7 Million
Global Market Growth Rate (2022-2032)	9% CAGR
North America Market Share (2021)	~7.6%
East Asia Market Growth Rate (2022-2032)	~10.7% CAGR
United States Market Growth Rate (2022-2032)	~7.8% CAGR
Market Share of Top 5 Companies	~27%
Key Companies Profiled	Appli-Tec Inc Chase Corporation Dow Dymax Henkel Corporation Inseto Masterbond Nextgen Adhesives Norland Products Panacol-Elosol GmbH Parson Adhesives Inc Tex Year Industries Inc Toagosei Co Ltd United Adhesives Zymet

Sales Analysis of Low-cure Stress Adhesives (2017-2021) Vs. Market Forecast Outlook (2022-2032)

Growth of the packaging, transportation, and construction industries, as well as technological advancements and developments, have together contributed to the increased demand for low-cure stress adhesives over the years.

Looking forward, over the next ten years, the global low-cure stress adhesives market is set to grow 2.4X in size.

• Short Term (2022 Q2 to 2025): Augmenting utilization and integration of low-cure stress adhesives in several applications to positively impact market growth.
• Medium Term (2025-2028): East Asia and North America anticipated to witness high demand for low-cure stress adhesives with favorable government initiatives.
• Long Term (2028-2032): Increase in use of silicon low-cure stress adhesives to be witnessed.

Between 2017 and 2021 historical period, the global low-cure stress adhesives market registered a CAGR of 2.2%, and according to Fact.MR, a market research and competitive intelligence provider, the industry is expected to register growth at 9% CAGR between 2022 and 2032.

Market share analysis of low-cure stress adhesives based on end use and region is provided in the above image. Under the end-use segment, consumer electronics dominates with 35.9% market share in 2022.

What’s Driving Demand for Low-cure Stress Adhesives?

“Growing Integration of Low-cure Stress Adhesives in Packaging Industry”

Industrial technologies are evolving at a rapid pace, faster than ever before. The packaging industry is growing fast, where the need for the right low-stress adhesives for MEMS packaging has gained traction among electronic device manufacturers.

End users such as consumer electronics, automation & robotics, healthcare & medical devices, aerospace & defense, automotive, chemicals & petrochemicals, and others make high use of adhesives for the packaging of components. Low-cure stress adhesives are highly sought-after for this purpose, which is driving target market growth.

“Specific Benefits of Low-cure Stress Adhesives Opening New Doors for Sellers”

An upsurge in the number of applications and manufacturing activities has completely changed the low-cure stress adhesives market in the last few years. Leading market players developed setups for the healthcare industry for vaccine and medicine development during the global pandemic. Increasing demand and lower supply created a pressure space where the cost of production rose and squeezed the price elasticity of demand.

Low-cure stress adhesives are fast-curing adhesives that reduce the cost and enhance the rate of production with minimal adhesion losses. Many manufacturers have adopted the strategy of collaborating with key assembly system manufacturers to lower their production costs and drive the sales of their products.

Advanced low-cure stress adhesives provide high reliability, fast curing, thermal stability, gap filling, and moisture and chemical resistance, with many advanced features that help enhance the quality of components. Thus, all these benefits of low-cure stress adhesives will open new doors of opportunities for manufacturing companies over the coming years.

“High Demand for Low-cure Stress Adhesives in Electronics Industry”

There are major uses of adhesives in the electronics industry, which include the bonding of surface-mount components (SMCs), wire tacking, and potting. Rapidly growing demand for electronics adhesives is pushing the market for low-cure stress adhesives to another level, thereby declining the demand for their substitutes gradually.

Boost in demand for electronics has pushed manufacturers to manipulate producer variables, where capital and labor have to be effectively cut down without reduction in the production rate. This has pushed the demand for adhesives to cut down the overall capital cost with little increase in production cost, which leads to lower cost parity for electrical equipment manufacturers.

Demand for low-cure stress adhesives from the electrical and electronics industry is slated to expand rapidly at 10.2% CAGR, bolstering the overall market stance of adhesives.

Country-wise Insights

Why is the U.S. Low-cure Stress Adhesives Market Expected to Grow 2X?

The United States low-cure stress adhesive market is currently estimated at US$ 42.1 million and is expected to reach US$ 89.5 million by 2032.

The United States is a prominent market for low-cure stress adhesives as it sees huge investments in the automotive, construction, and electronic industries. Growing construction projects and demand for composite joints will bode well for low-cure stress adhesive suppliers.

Development of renewable resources in the U.S., which is a replacement for petroleum-derived chemicals, is also creating an opportunity for low-cure stress adhesive manufacturers.

Because of technological advancements and new developments in the market, the United States will hold significant potential for low-cure stress adhesive sales over the coming years.

Why is the China Low-cure Stress Adhesives Market Highly Lucrative?

Since China has attracted significant investments for localized production and R&D to fulfil customer demand more effectively and rapidly, the market for low-cure stress adhesives here is predicted to demonstrate strong growth.

Market growth is anticipated to increase as a result of rising demand for electronic devices such as laptops, cellphones, and other electronic components. Market expansion is also being fueled by the fast demand growth of EV vehicles in the automotive industry in the country.

China accounts for a leading position at the country-level, holding roughly 50% of East Asia’s low-cure stress adhesives production in 2021. The China low-cure stress adhesives market is expected to reach a valuation of US$ 156.8 million by 2032.

Category-wise Insights

Why are Silicon Low-cure Stress Adhesives Most Widely Used?

There are several types of silicon adhesives with special properties, which include flexibility, fast curing process, high reliability, and much more. The viscosity of an adhesive is affected by the curing process, which increases until the adhesive is no longer useful. Silicon is most widely used as an adhesive for the bonding and sealing of glass material.

Silicon low-cure stress adhesives have been identified as being offered by most manufacturers across the world. The integration of silicon low-cure stress adhesives has increased steadily in the recent past and reached a market valuation of US$ 161.3 million at the end of 2021.

Furthermore, with a mounting global electronics and semiconductor market, consumption of silicon low-cure stress adhesives is predicted to expand 2.5X by the end of 2032.

Competitive Landscape

Prominent low-cure stress adhesive manufacturers are Appli-Tec Inc, Chase Corporation, Dow, Dymax, Henkel Corporation, Inseto, Masterbond, Nextgen Adhesives, Norland Products, Panacol-Elosol GmbH, Parson Adhesives Inc, Tex Year Industries Inc, Toagosei Co Ltd, United Adhesives, and Zymet.

The world’s leading manufacturers of low-cure stress adhesive products are employing sustainable technologies and increasing the processing power for diverse applications. Prominent manufacturers are focusing on developing new product features to address various end-user problems.

Moreover, resource channelization for planning, designing, and providing low-cure stress adhesives are crucial marketing strategies.

• In February 2021, Appli-Tec delivered its first Appli-Thane 7300 adhesive material, which is the best-in-class for thermal conductivity.
• In May 2022, Dow introduced the DOWSIL 6015 thermally conductive encapsulant, which provides exceptional thermal management for power electronic applications.
• In November 2021, Dymax, a leading manufacturer of curing materials and equipment, introduced its new adhesive 9501-F for electric vehicle battery assemblies.

Fact.MR has provided detailed information about the price points of key manufacturers of low-cure stress adhesives positioned across regions, sales growth, production capacity, and speculative technological expansion, in the recently published report.

Segmentation of Low-cure Stress Adhesives Market Research

• Low-cure Stress Adhesives Market by Substrate :

  • Silicon
  • Glass
  • Metal
  • Others

• Low-cure Stress Adhesives Market by Packaging :

  • Cans
  • Jars & Bottles
  • Cartridges
  • Syringes

• Low-cure Stress Adhesives Market by Application :

  • Optical
  • Electro-optical
  • Electronic
  • Fiber-Optics
  • Photonics
  • Others

• Low-cure Stress Adhesives Market by End Use :

  • Consumer Electronics
  • Automation & Robotics
  • Healthcare & Medical Devices
  • Aerospace & Defense
  • Automotive
  • Chemicals & Petrochemicals
  • Laboratory & Research
  • Others

• Low-cure Stress Adhesives Market by Sales Channel :

  • OEM
  • Aftermarket

• Low-cure Stress Adhesives Market by Region :

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia & Oceania
  • MEA