About the Report
The global die bonding pastes market is set to expand at a steady CAGR of around 5% throughout the 2021-2031 assessment period. Die bonding pastes have vast application in the field of electrical and electronics, these pastes are mostly used in SMT assemblies, semiconductor packaging, and LED/optoelectronics.
Die bonding pastes are used to attach semiconductor components/wafers to PCBs (printed circuit boards). In addition to bonding, they can help mitigate stress during system operation. Some die bonding pastes are both, thermally conductive and electrically insulating. They are available in various types in the form of sintering pastes, semi-sintering pastes, solder pastes, and epoxy.
Additionally, other end-use industries such as communications have numerous applications of die bonding pastes, as they extensively used in communication electronics. Also, higher consumption of consumer electronics is reflecting towards increasing die bonding paste utilization in the semiconductor packaging industry, which is set to bolster die bonding paste sales over the coming years.
Foremost objective of the latest report by Fact.MR on the die bonding pastes market is to pitch insights on the market scenario, demand generators, and technological advancements in this space. The report provides a taxonomy elaborating on key segments and also outlines visionary insights on the dynamics of the market, including the drivers, restraints, opportunities, trends and pricing analysis, along with key success factors. Market trends have been tracked in 20+ high-growth countries, pointing towards countries in North America, East Asia, and South Asia & Oceania holding bulk of the market share.
Historical Trends Vs Future Market Projections
From 2016 to 2020, the global die bonding pastes market growth exhibited a sluggish CAGR, with consumer electronics and communication industries playing a major role in driving demand. Increasing consumption of die bonding pastes in the global semiconductor packaging industry has been witnessed over the period.
Rising production of consumer electronics over the period has strengthened the prices of die bonding pastes. This is due increased spending on electronic goods by customers in order to ease personal and professional work. However, in FY2020, due to the COVID-19 pandemic, market growth dipped, owing to contraction in demand from the consumer electronics and semiconductor packaging industry. Apart from this, reduction in demand was observed from the global die bonding materials market as well.
Owing to these factors, demand over the long-term forecast period can be estimated by breaking the forecast timeline into three parts.
- Short-run: Recovery growth is set to be observed over this term.
- Medium-run: Demand and price normalization are set to be observed over this period.
- Long-run: Economic cycles and inflation rates to affect demand and pricing of the product.
All in all, the market is to expand at a moderate rate of around 5% through 2031, providing a promising stance for investors in the market.
Know More Details About the Report
What are the Primary Applications that Generate Demand for Die Bonding Pastes Market?
Semiconductor packaging and SMT assembly application are two major application sides that collectively account for more than fifty percent of the market share from the consumption side. Growing consumption of embedded circuitries from the electrical and electronic industry is contributing towards increased demand for die bonding pastes.
Despite the presence of other die bonding materials such as die bonding wires, films, etc., these application industries are majorly giving importance to die bonding pastes owing to their high electronic properties, life cycle, and other myriad benefits.
Which Region Offers Great Potential for Die Bonding Pastes?
The East Asia region, specifically China, accounted for the highest demand for die bonding pastes due to the presence of a large number of manufacturers in the region, supported by easy availability of raw materials. Further, presence of a large number of end-use industries such as consumer electronics, communication, medical, and automotive in the region has been a major reason for growing demand for die bonding pastes.
Also, South Asia & Oceania has been a major contributor to the market after East Asia. This region also has a large number of end-use industries. Also, the communication industry has been growing in this region owing to increasing support for expansion by regulatory bodies. Such initiatives will bolster demand from the communication industry, and thus, reflect towards growth in demand for die bonding pastes over the coming years.
What are the Upcoming Trends in This Market?
Die bonding paste manufacturers and stencil manufacturers are facing newer challenges with the trend of miniaturisation of electronics. Smaller components such as 0603 metrics, 0402 metrics, and 0.4 mm pitch BGAs (ball grid arrays) are becoming more popular, prompting end-use customers to upgrade from type 3 to type 4 or type 4.5 solder pastes.
Ceramic-type stencil nano-coatings, such as NanoSlic Gold, are becoming more popular in addition to changing solder paste size. Ceramic nano-coatings such as NanoSlic Gold increase transfer efficiency and minimise variation in the solder paste printing process. All these points have been supporting increasing consumption of type 4 or 4.5 solder pastes. Owing to these factors, manufacturers of die bonding pastes are investing in type 4 or 4.5 soldering paste, following which, tier 2 and 3 players are also following the same.
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Why Does China See Huge Demand for Die Bonding Pastes?
China holds a huge market share for die bonding pastes. This is due to the fact that, the country has a large number of key players, attributed to high raw material availability and lower operational costs. Companies in the country are equipped with advanced manufacturing and testing infrastructure, which has been one of the reasons for higher production rate of die bonding pastes.
Further, presence of end-use industries in the country is on the higher side, which is allowing manufacturers to collaborate with them for continuous business opportunities. Also, China has been a major exporter of die bonding paste around the globe, owing to higher production capacity. Thus, all these factors are responsible for projecting a higher market share of China in the East Asia and global market.
Why is Taiwan Considered as One of the Key Markets for Die Bonding Pastes?
Taiwan shows similar economy stats as of China for almost all these industries. From the 1990s, Taiwan’s electronics industry, which includes consumer electronics, information electronics, and communication electronics, has experienced tremendous growth in both, production and sales.
Thus, consumption of die bonding pastes from these industries is also increasing and continues to do so. Also, organizations such as TEEMA (Taiwan Electrical and Electronic Manufacturers’ Association) in the country are acting as a backbone to all electronics device and material manufacturers for providing a sound platform between the government and.
Which Type of Die Bonding Paste Accounts for Highest Market Share?
Conductive die bonding pastes account for a higher market share in the conductivity segment. Majority of semiconductor packaging applications use conductive die bonding paste in circuitries, and this application industry holds a majority of the market share. Owing to such high application, majority of key player’s product portfolios have a large number of products in conductive die bonding paste.
Non-conductive die bonding paste is mostly used in laminate and lead frame packaging applications. These application industries are newly switching to non-conductive die bonding pastes from non-conductive die bonding wires. Thus, the market for non-conductive die bonding paste has less value share and will take a lot of years to pick pace.
How is the Semiconductor Packaging Industry Driving Market Growth?
The semiconductor packaging industry plays a major part in the global electronics industry. Also, it is the prime demand driver for die bonding pastes. Semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. The package provides a means to connect to the external environment.
The semiconductor packaging industry has been progressing to reduce costs and improve the overall efficacy of integrated circuits. Market vendors are constantly under pressure to deliver innovative solutions in terms of packaging size, performance, and "time-to-market" considerations.
Aside from the wide range of semiconductor packaging applications in consumer electronics and automotive, it also plays an important role in aerospace and defence. Researchers from the US Army are working on new ways to package Silicon Carbide (SiC) power semiconductors so that they can be used in high-power military and commercial applications.
With such demand from the consumption side for semiconductor packaging, the requirement for die bonding materials is increasing exponentially. Further, advancements in bonding paste formulations and life cycle would boost utilization rate in the semiconductor packaging industry.
How are Rising Investments in Jetting-based Die Bonding Pastes Affecting Overall Demand?
Manufacturers involved in the semiconductor packaging industry are shifting towards fast and efficient semiconductor packaging machines such as jet wave machines. Jet wave machines either use both, soldering and sintering pastes, or have the capability of soldering components on the circuit with high accuracy in a limited time frame. As such, the requirement for die bonding pastes for these machines has been significantly increasing.
Recently, companies such as Indium have developed sintering-based die bonding pastes compatible with jet wave machines, to be used in dispensing ultra-fine dispensing and jetting operations. Higher adoption rate of such jet able die bonding pastes by end users is enabling manufacturers to invest in them more, affecting overall market demand in a positive way.
An Adaptive Approach to Modern-day Research Needs
Key players rely on organic and inorganic strategies to gain market position in lucrative markets. These strategies include product launches, collaborations with key players, partnerships, acquisitions, and strengthening of regional and global distribution networks.
- For instance, Henkel, one of the leading market players in die bonding pastes, invested in expanding its product portfolio of high thermal conductivity die bonding pastes for high power application electronic devices.
Similarly, recent developments related to companies manufacturing die bonding pastes have been tracked by the team at Fact.MR, which is available in the full report.
Historical Data Available for
US$ Mn for Value
Key Regions Covered
Key Countries Covered
Key Segments Covered
Key Companies Profiled
Key Questions Answered in Report
How will the market expand until 2031?
Fact.MR projects the market to register a CAGR around 5% across the 2021-2031 assessment period. Higher penetration in the consumer electronics and communications industry is set to bolster demand over the coming years.
Which country is contributing towards market growth?
As per Fact. MR’s projections, China is expected to hold a pivotal role driving demand for die bonding pastes. Surge in demand from the semiconductor packaging industry and SMT assembly industry is set to be observed across the country.
Which players are prevalent in this landscape?
Prominent players manufacturing die bonding pastes include Indium, Henkel Adhesives, Alpha Assembly Solutions, Sumitomo Bakelite, Asahi Solder, AI Technology, Showa Denko Materials (America) Inc., Tamura, Nordson EFD, Shenmao Technology, Inkron, AIM, Heraeu, DoW, and SMIC (Senju Metal Industry Co.).
Key Market Segments Covered
- Conductive Die Bonding Pastes
- Non-conductive Die Bonding Pastes
- Sintering Paste
- Semi-Sintering Paste
- Solder Paste
- Epoxy Paste
- Silver-Glass Paste
- Die Bonding Pastes for SMT Assemblies
- Die Bonding Pastes for Semiconductor Packaging
- Die Bonding Pastes for LED/Optoelectronics
By End-use Industry
- Die Bonding Pastes for Consumer Electronics
- Die Bonding Pastes for Industrial Use
- Die Bonding Pastes for Automotive
- Die Bonding Pastes for Medical
- Die Bonding Pastes for Communications
- North America
- East Asia
- South Asia & Oceania
- Rest of World
Die Bonding Pastes Market- Scope of Report
A recent study by Fact.MR on the die bonding pastes market offers a 10-year forecast for 2021 to 2031. The study analyzes crucial trends that are currently determining the growth of the market. This report explicates on vital dynamics, such as the drivers, restraints, and opportunities for key market players along with key stakeholders as well as emerging players associated with the production of die bonding pastes. The study also provides the dynamics that are responsible for influencing the future status of the market over the forecast period.
A detailed assessment of value chain analysis, business execution, and supply chain analysis across regional markets has been covered in the report. A list of prominent companies manufacturing die bonding pastes, along with their product portfolios, enhances the reliability of this comprehensive research study.
The study offers comprehensive analysis on diverse features, including production capacities, demand, product developments, revenue generation, and sales in the market across the globe.
A comprehensive estimate has been provided through an optimistic scenario as well as a conservative scenario, taking into account the sales of die bonding pastes during the forecast period. Price point comparison by region with global average price is also considered in the study.
Analysis on Market Size Evaluation
The market has been analyzed for each market segment in terms of volume (Tons) and value (US$ Mn).
Market estimates at global and regional levels for die bonding pastes are available in terms of “US$ Mn” for value and in “Tons” for volume. A Y-o-Y growth contrast on prominent market segments, along with market attractiveness evaluation, has been incorporated in the report. Furthermore, absolute dollar opportunity analysis of all the segments adds prominence to the report. Absolute dollar opportunity plays a crucial role in assessing the level of opportunity that a manufacturer/distributor can look to achieve, along with identifying the potential resources, considering the sales and distribution perspective in the global die bonding pastes market.
Inspected Assessment on Regional Segments
Key sections have been elaborated in the report, which have helped deliver projections on regional markets. These chapters include regional macros (political, economic, and business environment outlook), which are expected to have a momentous influence on the growth of the die bonding pastes market during the forecast period.
Country-specific valuation on demand for die bonding pastes has been offered for each regional market, along with market scope estimates and forecasts, price index, and impact analysis of the dynamics of prominence in regions and countries. For all regional markets, Y-o-Y growth estimates have also been incorporated in the report.
Detailed breakup in terms of value and volume for emerging countries has also been included in the report.
In-depth Analysis on Competitive Landscape
The report sheds light on the leading manufacturers of die bonding pastes, along with their detailed profiles. Essential and up-to-date data related to market performers who are principally engaged in the production of die bonding pastes has been brought with the help of a detailed dashboard view. Market share analysis and comparison of prominent players provided in the report permits report readers to take preemptive steps in advancing their businesses.
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Is the market research conducted by Fact.MR?
Yes, the report has been compiled by expert analysts of Fact.MR, through a combination of primary and secondary research. To know more about how the research was conducted, you can speak to a research analyst.
What research methodology is followed by Fact.MR?
Fact.MR follows a methodology that encompasses the demand-side assessment of the market, and triangulates the same through a supply-side analysis. This methodology is based on the use of standard market structure, methods, and definitions.
What are the sources of secondary research?
Fact.MR conducts extensive secondary research through proprietary databases, paid databases, and information available in the public domain. We refer to industry associations, company press releases, annual reports, investor presentations, and research papers. More information about desk research is available upon request.
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