Automatic Dicing Saw Market Forecast and CAGR
According to latest research by Fact.MR, automatic dicing saw market is set to witness steady growth during 2021-2031. The demand will witness steady recovery in short-term, with optimistic growth outlook in the long-run. Growing semiconductor industry will amplify the opportunities in near future, and the application of automatic dicing saw in military & defense sector will provide momentum.
What is Driving Demand for Automatic Dicing Saw?
Automatic dicing saws are involved in cutting process controlled automatically through software programming. Various applications of the product include cutting semiconductor and ceramic materials into almost any shapes with straight edges.
The significant demand for dicing saw comes from electronics and semiconductor industry where gradual increase in mass production and sales of various wafer dicing saw products and chiller for semiconductor production per year across the world.
In addition to traditional applications in semiconductor industry, the adoption is growing in the automotive and defense sector. The product has significant application in power modules, MEMS & Sensors for the automotive, industrial, mobile and medical market.
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Semiconductor Industry Growth to be the Torch Bearer for Automatic Dicing Saw Sales
Rising demand for number of semiconductor devices required for data centers and IoT and along with increasing self-driving cars, component manufacturing sector are some of the major factors to drive the automatic dicing saws sales.
With penetration of semiconductors in almost all industry verticals the market is anticipated to witness growth. Manufacturers are focused on reducing footprints while improving production capacities at the same time, hence sales are likely to improve over the course of the assessment period.
Asia Pacific Market Outlook
Asia-Pacific being the major semiconductor components production hub in the world and is anticipated to remain so for the coming years. Growing initiatives by the Chinese government such as Vision 2020 have strongly drawn attention from the international players to set up local production establishments. China remains worlds’ leading semiconductor manufacturer and hence significant demand for dicing saws.
Another emerging country in the region, Vietnam, has witnessed the recent rise in customs duties on imported electronics is creating a critical role in attracting tier one players like Apple to set up local plants. Again, study by SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, suggested that more than 90% of the foundries constructed in the world during 2017 were situated in the Asia Pacific.
It is anticipated that most of these foundries are focused in Japan & China which is expected to open up better opportunities for the automatic dicing equipment in the long term.
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Europe Demand Outlook for Automatic Dicing Saw
Some of the leading product manufacturers in Europe are focused on supplying the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency which is further creating opportunities for growth in the region.
Who are the Key Manufacturers and Suppliers of Automatic Dicing Saw?
Some of the leading manufacturers and suppliers of Automatic Dicing Saw include
- DISCO Corporation
- Dynatex International
- TOKYO SEIMITSU
- Loadpoint Micross Components
- SR Co.Ltd
- Advanced Dicing Technologies Ltd. (ADT)
- Shenyang Heyan Technology Co.Ltd.
Major OEM companies dealing in automatic dicing saw business are providing semi as well as fully automatic dicing saws to suit a wide range of application requirements, from semiconductor research and development, through to medium and high volume production applications. Suppliers offers the equipment with a variety of capabilities, configurations as well as levels of automation, as well as peripheral accessories and instrumentation, to cater to an ever-growing range of buyer requirements.
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- Semi - Automatic
- Full - Automatic
- Silicon wafers Dicing
- Semiconductors Dicing
- Glass sheets Dicing
- Ceramic Dicing
By Dicing Blade
- Nickel-Bond Dicing Blades
- Resin-Bond Dicing Blades
- Metal Sintered Dicing Blades
By End-use Industry
- Electronics & Semiconductor
- Military & Aerospace
- Passive Component Manufacturing
- North America
- Latin America
- South Asia & Pacific
- East Asia
- South Korea
- Middle East and Africa
- GCC Countries
- Northern Africa
- South Africa
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.
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