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3D Through-Silicon-Via (TSV) Devices Market

3D Through-Silicon-Via (TSV) Devices Market

3D Through-Silicon-Via (TSV) Devices Market Growth to Spur on the Back of Rising Demand for Electronic Device Miniaturization during 2021-2031

3D Through-Silicon-Via (TSV) Devices Market
FACT6959MR
  • Sep-2021
  • List of Tables : 84
  • List of Figures : 112
  • 170 Pages
  • Technology

Market Snapshot

As per latest industry analysis published by Fact.MR, the global 3D through-silicon-via (TSV) devices market was valued at around US$ 5 Bn in 2020, and is expected to reach a valuation of US$ 15 Bn by 2031, accelerating rapidly at a CAGR of 20%. Demand for advanced LED packaging is high and is projected to increase at a CAGR of 18% across the assessment period of 2021 to 2031.

Key Points Covered in 3D Through-Silicon-Via Devices Industry Survey:

  • Market Estimates and Forecasts (2016-2031)
  • Key Drivers and Restraints Shaping Market Growth
  • Global 3D TSV Devices Market Size in 2021
  • Segment-wise, Country-wise, and Region-wise Analysis
  • Global 3D TSV Devices Market Growth to 2031
  • Competition Mapping and Benchmarking
  • Brand Share and Market Share Analysis
  • Key Product Innovations and Regulatory Climate
  • COVID-19 Impact on Demand for 3D Through-Silicon-Via Devices and How to Navigate
  • Recommendation on Key Winning Strategies

Know More Details About the Report

Revenue Analysis of 3D TSV Devices from 2016 to 2020 Compared to Market Outlook for 2021 to 2031

As per Fact.MR, a market research and competitive intelligence provider, the global market for 3D through-silicon-via devices was valued at US$ 5 Bn in 2020.

Rising demand for electronic device miniaturization and growing use of innovative chip architectures with enhanced characteristics are creating growth opportunities for manufacturers of 3D through-silicon-via devices.

The semiconductor industry is leveraging 3D TSV technology for developing biomedical devices with sensors & processors and highly heterogeneous integration, which, in turn, is aiding demand traction for 3D TSV devices.

3D TSV in dynamic random-access memory (DRAM) that stores each bit of data in a separate tiny capacitor within an integrated circuit is propelling the growth of the market. 3D TSV technology has also gained notable traction for enhancing 3D TSV logic & memory devices, non-memory, and CMOS such as televisions, smartphones, and tablet PCs.

These factors are expected to drive demand for 3D through-silicon-via devices rapidly at 20% CAGR from 2021 to 2031.

How is Superior Performance over Conventional Techniques Creating Opportunities for 3D Through-Silicon-Via Device Suppliers?

3D through-silicon-via device is a high performance interconnect technique that passes through a silicon wafer by a vertical electrical connection which lower power consumption and gives a better electrical performance.

Growing requirement for 3D stacking to shorten the length of interconnection, reduce power intake, accelerate signal speed, and decrease power dissipation has been driving the demand for 3D TSV technology.

The semiconductor industry is witnessing burgeoning demand for three-dimensional (3D) through-silicon-via technology devices with superior functionality, better performance, smaller form factor, and reduced overall cost.

Global 3D TSV device manufacturers are focusing on development of innovation-driven packaging solutions. Several semiconductor manufacturers and research institutes have considered 3D packaging based on z-axis TSV stacking concept, which is further creating opportunities for stakeholders in the global 3D TSV devices market.

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What are the Restraints being Encountered by 3D TSV Device Manufacturers?

Numerous negative effects of TSV devices such as delay, area, and power overhead caused by non-negligible TSV area and capacitance are limiting their sales. As widespread benefits of 3D through-silicon-via devices such as reduction of wire length and high performance from 3D integration rely on the size and capacitance of TSV, the market is witnessing restricted growth.

To counter such challenges, top manufacturers of 3D TSV CMOS image sensors are increasingly focusing on reducing overall semiconductor cost, form factor, and time-to-market.

Which Region Offers Lucrative Opportunity for 3D Through-Silicon-Via Device Producers?

The Asia Pacific region leads with more than 50% share in the 3D through-silicon-via devices market. Asia Pacific is also one of the most active manufacturing hubs in the world.

Rising popularity of smartphones and demand for 3D TSV memory technologies have increased demand for 3D TSV imaging and opto-electronics, thereby, creating a wide range of opportunities in the region.

As silicon wafers are widely used to manufacture smartphones, introduction of 5G technology is expected to boost the sales of 5G smartphones, which may grow the market in the telecommunication sector.

Increasing demand for CMOS image sensors in Japan as well as demand for collective laser assisted bonding process for 3D TSV integration using nonconductive paste (NCP) in South Korea are supplementing demand for 3D through-silicon-via devices throughout these countries, and allows the simultaneous stacking of many TSV dies to enhance productivity.

3D through-silicon-via tsv devices market regional analysis by Fact.MR

An Adaptive Approach to Modern-day Research Needs

Country-wise Analysis

What is the 3D TSV Devices Demand Outlook for the U.S.?

The U.S. market for 3D through-silicon-via devices was valued at over US$ 800 Mn in 2020. Increasing R&D activities related to 3D IC design is aiding market growth. Rising use of TSV technology for 3D packaging in the semiconductor sector is being fueled by the requirement to enhance performance and lower time delays.

Also, growing use of TSV technology for functional integration along with wafer fabrication and assembly in the semiconductor sector and rising sales of 3D TSV sensors in the U.S. are spurring market growth.

What are the Growth Opportunities for 3D TSV Device Providers across China?

By 2031, China is expected to enjoy a market value of roughly US$ 4 Bn. Manufacturers of 3D TSV devices in China investing in next generation of 3D TSV technology and shorter product development cycles, which have further driven the exports of electronic goods.

With rising sales of 3D TSV MEMS and sensors and growing advancements in consumer applications such as smartphones, tablets and wearable products, the CIS and MEMS markets are expected to exhibit robust growth. This, in turn, fueling market growth in China.

Category-wise Insights

Why is the Popularity of Advanced LED Packaging Rising Rapidly?

Increasing use of advanced light-emitting diodes (LED) packaging in products has promoted the development of higher power, greater density, and lower-cost devices. Use of three-dimensional (3D) packaging through-silicon-via (TSV) technology allows a high density of vertical interconnects, unlike 2D packaging.

Integrated TSV circuits reduce connection lengths, and thus, smaller parasitic capacitance, inductance, and resistance are required where a combination of monolithic and multifunctional integration is done efficiently, which provides high-speed low-power interconnects.

The embedded design with thin silicon membranes at the bottom optimizes thermal contact, and therefore minimizes thermal resistance. Silicon via (TSV) provides electrical contact to surface-mounted devices and mirrored sidewalls increase package reflectivity and improve the light efficiency.

SUSS AltaSpray technology is capable of coating integration of 90° corners, KOH (potassium hydroxide) etched cavities, through silicon via (TSV), ranging from a few microns to 600μm or more.

The ability to produce conformal resist coatings on severe topography, such as TSV, makes them the ideal choice for wafer-level packaging in LED, and advancements of 3D TSV technology in LED packaging will drive market growth over the decade.

Which Application is Fueling Sales of 3D Through-Silicon-Via Devices?

The consumer electronics sector is thriving due to growing global penetration of smartphones, which can be attributed to easy availability of high-tech features such as powerful camera systems, high-resolution displays, followed by economical mobile data services in most regions.

Increasing demand for 3D TSV technology is rapidly changing the consumer electronics space, with users demanding improved architecture in electronic products.

Leveraging its capability to deliver advanced integrated chip models with lesser footprint and decreased capacitance, three-dimensional (3D) through-silicon-via technology is progressively being used in improving memory, logic functions of electronics, CMOS, and non-memory, such as tablet PCs, smartphones, and televisions, among others.

Propagation of 3D TSV in the DRAM memory vertical with pioneering technology platforms such as Wide I/O, High Bandwidth Memory (HBM), innovations in 3D TSV technology, and Hybrid Memory Cube (HMC) is also contributing to market growth.

How Has COVID-19 Impacted Demand for 3D TSV Devices?

In light of the recent COVID-19 outbreak, the operations of numerous industries have either been temporarily halted or are functioning with a minimal workforce due to enforced lockdowns and imposed restrictions by respective governing bodies.

The global 3D TSV market is no different, and this factor is anticipated to have a significantly negative impact on revenue growth of this industry.

3D TSV technology for biomedical devices and latest trends of global 3D TSV devices are major factors supporting market growth. Change in consumer demand and buying patterns during the COVID-19 pandemic is somewhat positively impacting the progress of the 3D through-silicon-via devices market.

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Competitive Landscape

Top manufacturers of 3D TSV sensors are experiencing cut-throat competition due to rise in the sales of 3D TSV CMOS image sensors across the world and numerous players in this space.

  • In October 2019, Samsung developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses TSVs to create high-capacity high bandwidth memory devices for applications, such as higher-end graphics, FPGAs, and compute cards.

3D TSV Devices Industry Report Scope

Attribute

Details

Market size value in 2020

USD 5 Billion

Market forecast value in 2031

USD 15 Billion

Growth Rate

CAGR of 20% from 2021 to 2031

Forecast Period

2021-2031

Historical Data Available for

2016-2020

Market Analysis

US$ Mn for Value & ‘000 Units for Volume

Key Regions Covered

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia
  • Oceania
  • MEA

Key Countries Covered

  • U.S.
  • Canada
  • Germany
  • U.K.
  • France
  • Spain
  • Italy
  • Russia
  • China
  • Japan
  • South Korea
  • India
  • Australia
  • Brazil
  • Mexico
  • Argentina
  • GCC
  • South Africa

Key Market Segments Covered

  • Product
  • Process Realization
  • Application
  • Region

Key Companies Profiled

  • Amkor Technology, Inc.
  • Broadcom Ltd.
  • Pure Storage, Inc.
  • STATS ChipPAC Ltd.
  • SK Hynix Inc.
  • Invensas Corporation
  • Samsung Electronics Co., Ltd.
  • ASE Technology Holding, Co., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • United Microelectronics Corporation
  • Sony Corporation
  • Teledyne DALSA Inc.
  • Xilinx Inc.
  • Intel Corporation

Pricing

Available upon Request

Key Segments in 3D TSV Devices Industry Research

  • Product

    • 3D TSV Memory
    • 3D TSV Advanced LED Packaging
    • 3D TSV CMOS Image Sensors
    • 3D TSV Imaging and Opto-Electronics
    • 3D TSV MEMS
  • Process Realization

    • 3D TSV Devices Via First Process Realization
    • 3D TSV Devices Via Middle Process Realization
    • 3D TSV Devices Via Last Process Realization
  • Application

    • Use of 3D TSV Devices in Consumer Electronics
      • Use of 3D TSV Devices in Mobile Devices
      • Use of 3D TSV Devices in Processors in Computers and Laptops
    • Use of 3D TSV Devices in Automotive Sector
      • Use of 3D TSV Devices in Automotive Sensors
      • Use of 3D TSV Devices in Automotive Body Electronics
    • Use of 3D TSV Devices in IT and Telecom
      • Use of 3D TSV Devices in Communications
      • Use of 3D TSV Devices in Information Technology & Networking
    • Use of 3D TSV Devices in Healthcare Sector
    • Use of 3D TSV Devices in Military, Aerospace & Defense Sector

3D Through-Silicon-Via (TSV) Devices Market: Report Scope

A recent study by Fact.MR on the 3D through-silicon-via (TSV) devices market offers a 10-year forecast for 2021 to 2031. The study analyzes crucial trends that are currently determining the growth of the market. This report explicates recent market developments, strategic market growth analysis, market size, category market growths, product approvals, product launches, geographical expansions, and technological innovations associated with 3D through-silicon-via devices market!

The study also provides the dynamics responsible for influencing the future status of the 3D through-silicon-via devices market over the forecast period. A detailed assessment of value chain analysis, business execution, and supply chain analysis across regional markets has been covered in the report.

A list of prominent companies operating in 3D through-silicon-via devices market, along with their product portfolios, enhances the reliability of this comprehensive research study.

Report Summary

The study offers comprehensive analysis on diverse features, including revenue growth, product enhancements, and revenue generation from 3D through-silicon-via devices across the globe.

A comprehensive estimate on the market has been provided through an optimistic scenario as well as a conservative scenario, taking into account the revenue through of 3D through-silicon-via devices during the forecast period. Price point comparison by region with global average price is also considered in the study.

Key Questions Answered in Report

  • Which are the most lucrative markets for 3D TSV devices?
  • Which factors will impact the growth of the market?
  • How will changing trends impact the strategies of market players?
  • How can market players capture the low-hanging opportunities across regions?
  • Which companies are leading the 3D TSV devices industry?
  • What are the winning strategies of stakeholders in the market?

Analysis on Market Size Evaluation

The market has been analyzed for each market segment in terms of value (US$ Mn).

Market estimates at global and regional levels for 3D through-silicon-via devices are available in terms of “US$ Mn”. A Y-o-Y growth contrast on prominent market segments, along with market attractiveness evaluation, has been incorporated in the report. Furthermore, absolute dollar opportunity analysis of all the segments adds prominence to the report. Absolute dollar opportunity plays a crucial role in assessing the level of opportunity that a company can look to achieve, along with identifying potential resources, considering the revenue perspective in the global 3D through-silicon-via devices market.

Inspected Assessment on Regional Segments

Key sections have been elaborated in the report, which have helped deliver projections on regional markets. These chapters include market forces analysis, which is expected to have a momentous influence on the growth of the 3D through-silicon-via devices market during the forecast period.

Country-specific valuation on revenue for 3D through-silicon-via devices has been offered for each regional market, along with market scope estimates and forecasts, and impact analysis of the dynamics of prominence in regions and countries. For all regional markets, Y-o-Y growth estimates have also been incorporated in the report.

Detailed breakup in terms of value for key countries has also been included in the report.

Competition Analysis

The report sheds light on leading providers of 3D through-silicon-via devices, along with their detailed profiles. Essential and up-to-date data related to market performers who are principally engaged in the 3D through-silicon-via devices has been brought with the help of a detailed dashboard view. Market share analysis and comparison of prominent players provided in the report permits report readers to take preemptive steps in advancing their businesses.

Company profiles have been included in the report, which include essentials such as product portfolios and key strategies, along with all-inclusive SWOT analysis on each player. Company presence is mapped and presented through a matrix for all the prominent players, thus providing readers with actionable insights, which helps in thoughtfully presenting the market status, and predicting the competition level in the 3D through-silicon-via devices market.

Research Methodology

In Fact.MR’s study, a unique research methodology is utilized to conduct extensive research on the growth of 3D through-silicon-via devices market, and reach conclusions on the future growth parameters. This research methodology is a combination of primary and secondary research, which helps analysts ensure the accuracy and reliability of the drawn conclusions.

Secondary resources referred to by analysts during the preparation of the market study include statistics from governmental organizations, trade journals, white papers, and internal and external proprietary databases. Analysts have interviewed senior managers, product portfolio managers, CEOs, VPs, marketing/product managers, and market intelligence managers, all of whom have contributed to the development of the research report as a primary resource.

- FAQs -

The global 3D through-silicon-via devices market is currently worth more than US$ 5 Bn.

From 2016-2020, sales of 3D TSV devices registered a CAGR of 10%.

Major factors driving demand are miniaturization of electronic devices, increasing need for saving space in packages, and shorter reaction time.

Sales of 3D through-silicon-via devices in India are forecasted to reach over US$ 600 Mn by 2031.

Key players operating in this space are Amkor Technology, Inc., Broadcom Ltd., Pure Storage, Inc., STATS ChipPAC Ltd., and SK Hynix Inc.

The Asia Pacific region, with 50% global market share, will largely contribute to the growth of 3D through-silicon-via devices revenue.

3D through-silicon-via device sales in Germany are expected to rise at a CAGR of 15% over the forecast period of 2021 to 2031.

Advanced LED packaging application accounts for a share of 40% in the market.

The U.S., China, U.K, Japan, and South Korea are expected to drive most of the demand for 3D TSV devices.

The global market is anticipated to surge at a CAGR of 20% over the forecast period of 2021 to 2031.

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Is the market research conducted by Fact.MR?

Yes, the report has been compiled by expert analysts of Fact.MR, through a combination of primary and secondary research. To know more about how the research was conducted, you can speak to a research analyst.

What research methodology is followed by Fact.MR?

Fact.MR follows a methodology that encompasses the demand-side assessment of the market, and triangulates the same through a supply-side analysis. This methodology is based on the use of standard market structure, methods, and definitions.

What are the sources of secondary research?

Fact.MR conducts extensive secondary research through proprietary databases, paid databases, and information available in the public domain. We refer to industry associations, company press releases, annual reports, investor presentations, and research papers. More information about desk research is available upon request.

Who are the respondents for primary research?

Fact.MR speaks to stakeholders across the spectrum, including C-level executives, distributors, product manufacturers, and industry experts. For a full list of primary respondents, please reach out to us.

Is a sample of this report available for evaluation?

Yes, you can request a sample, and it will be sent to you through an email.